Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Integrated Microsystems)
Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Integrated Microsystems)
ISBN: 9781596932463
出版社: Artech House Publishers
出版年: 2008-11-30
页数: 430
定价: USD 159.00
装帧: Hardcover
内容简介
Today's microchips have nearly reached their performance limits. Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthroughs in microfluidics, high-density compliant electrical interconnects, and nanophotonics that are converging to solve them. Engineers get full details on state-of-the-art I/O interconnects and packaging, along with the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication. It brings readers up to speed with the latest heat removal technologies including chip-scale microchannel cooling, integrated micropumps and fluidic channels, and carbon nanotube interconnects.