Area Array Package Design
Area Array Package Design
ISBN: 9780071428279
作者: GILLEO KEN
出版社: McGraw-Hill
出版年: 2003-10-01
定价: 1100.8
内容简介
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Packag