Fabrication, Packaging and Integration of MEMS and Related Microsystems

ISBN: 9780387728926

³ö°æÄê: 2012-6

Ò³Êý: 500

¶¨¼Û: $ 163.85

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This is the first book dedicated to packaging and integration of MEMS and related Microsystems. While packaging was once considered secondary, it has now developed its own standards throughout the world. The book discusses the three key features for next generation application specific systems-on-a-chip (SOC): Mixed Signals, Mixed Environmental Domains, and Varying Scales of Devices and Packaging Components.