System-in-Package RF Design and Applications

ISBN: 9781580539050

出版社: Artech House

出版年: 2006-12

页数: 221

定价: $ 111.87

装帧: HRD

内容简介

In the past few years, System in Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. Here's the first comprehensive resource on SiP design techniques that offers designers state-of-the-art packaging know-how. Moreover, the book provides numerous examples that illustrate real-world capabilities, constraints, trade-offs, and options at every step.